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      Job Title Job Type Work Place Operation
      岗位职责:
      1.跟踪客户,提供技术支持,解决客户在应用中遇到的问题.
      2.了解客户的需要,并适当地根据客户的需要进行应用设计.
      3.不断的进行对产品的了解及相关技术的学习.
      4.了解市场的动向,及竞争对手对于产品的信息.
      5.配合公司内市场人员提供市场推广技术支持.

      Job Description:
      1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
      2.Learning the requirements from customer and providing customized developing according to the priority.
      3.Keeping studying company’s new products and the relevant technology.
      4.Tracking the market trends and learning the spec of competitors’ products.
      5.ooperating with marketing specialist to promote company’s new products to market.

      任职要求:
      1.电子工程或相关专业本科及以上学历.
      2.了解基于ARM处理器的SOC架构,熟悉高速总线,DDR,PCIe控制器,GMII/SGMII,MIPI以及各种标准低速外设接口。
      3.三年以上高速数字电路系统集成设计开发经验,熟练使用2种以上EDA原理图设计工具。
      4.熟悉电路板性能和功耗评估以及热效率分析。
      5.具备配合BSP软件工程师定位调试问题能力
      6.具备良好的问题分析能力,沟通能力和团队合作意识,车载电子行业工作经验者优先。

      Job requirements:
      1.Bachelor’s degree or above on electronic engineering or similar major background.
      2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
      3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
      4.Having knowledge on board level performance/power consumption/thermal analysis.
      5.Having capability of trouble shooting with BSP software engineer together.
      6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.
      岗位职责:
      1.跟踪客户,提供技术支持,解决客户在应用中遇到的问题.
      2.了解客户的需要,并适当地根据客户的需要进行应用设计.
      3.不断的进行对产品的了解及相关技术的学习.
      4.了解市场的动向,及竞争对手对于产品的信息.
      5.配合公司内市场人员提供市场推广技术支持.

      Job Description:
      1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
      2.Learning the requirements from customer and providing customized developing according to the priority.
      3.Keeping studying company’s new products and the relevant technology.
      4.Tracking the market trends and learning the spec of competitors’ products.
      5.ooperating with marketing specialist to promote company’s new products to market.

      任职要求:
      1.电子工程或相关专业本科及以上学历.
      2.了解基于ARM处理器的SOC架构,熟悉高速总线,DDR,PCIe控制器,GMII/SGMII,MIPI以及各种标准低速外设接口。
      3.三年以上高速数字电路系统集成设计开发经验,熟练使用2种以上EDA原理图设计工具。
      4.熟悉电路板性能和功耗评估以及热效率分析。
      5.具备配合BSP软件工程师定位调试问题能力
      6.具备良好的问题分析能力,沟通能力和团队合作意识,车载电子行业工作经验者优先。

      Job requirements:
      1.Bachelor’s degree or above on electronic engineering or similar major background.
      2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
      3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
      4.Having knowledge on board level performance/power consumption/thermal analysis.
      5.Having capability of trouble shooting with BSP software engineer together.
      6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

      岗位职责:
      1.跟踪客户,提供技术支持,解决客户在应用中遇到的问题.
      2.了解客户的需要,并适当地根据客户的需要进行应用设计.
      3.不断的进行对产品的了解及相关技术的学习.
      4.了解市场的动向,及竞争对手对于产品的信息.
      5.配合公司内市场人员提供市场推广技术支持.

      Job Description:
      1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
      2.Learning the requirements from customer and providing customized developing according to the priority.
      3.Keeping studying company’s new products and the relevant technology.
      4.Tracking the market trends and learning the spec of competitors’ products.
      5. Cooperating with marketing specialist to promote company’s new products to market.

      任职要求:
      1.计算机或相关专业本科及以上学历.
      2.坚实的C语言开发能力并能读懂数字电路原理图设计逻辑。
      3.了解基于ARM处理器的SOC架构,熟悉高速总线,DDR,PCIe控制器,GMII/SGMII,MIPI以及其它各种标准低速外设接口。
      4.5年以上嵌入式系统软件设计开发经验,至少2年以上BSP支持经验或者硬件驱动开发经验。
      5.熟悉bootloader以及流程,熟悉Linux 内核,有FreeRTOS应用开发经验者优先。
      6.熟悉开源社区GIT并能熟练应用相关工具。
      7.具备良好的问题分析能力,沟通能力和团队合作意识,车载电子行业工作经验者优先。


      Job requirements:
      1.Bachelor’s degree or above on computer science or similar major background.
      2.Solid C language knowledge and being capable to understand the digital schematic design logic.
      3.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
      4.5+ years’ developing experience in embedded system and at least 2+ years’ experience in BSP supporting and driver developing.
      5.Being familiar with bootloader, Linux kernel and being experienced with FreeRTOS is a plus.
      6.Being familiar with open source community and the tools.
      7.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

      岗位职责:
      1.跟踪客户,提供技术支持,解决客户在应用中遇到的问题.
      2.了解客户的需要,并适当地根据客户的需要进行应用设计.
      3.不断的进行对产品的了解及相关技术的学习.
      4.了解市场的动向,及竞争对手对于产品的信息.
      5.配合公司内市场人员提供市场推广技术支持.

      Job Description:
      1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
      2.Learning the requirements from customer and providing customized developing according to the priority.
      3.Keeping studying company’s new products and the relevant technology.
      4.Tracking the market trends and learning the spec of competitors’ products.
      5. Cooperating with marketing specialist to promote company’s new products to market.

      任职要求:
      1.计算机或相关专业本科及以上学历.
      2.坚实的C语言开发能力并能读懂数字电路原理图设计逻辑。
      3.了解基于ARM处理器的SOC架构,熟悉高速总线,DDR,PCIe控制器,GMII/SGMII,MIPI以及其它各种标准低速外设接口。
      4.5年以上嵌入式系统软件设计开发经验,至少2年以上BSP支持经验或者硬件驱动开发经验。
      5.熟悉bootloader以及流程,熟悉Linux 内核,有FreeRTOS应用开发经验者优先。
      6.熟悉开源社区GIT并能熟练应用相关工具。
      7.具备良好的问题分析能力,沟通能力和团队合作意识,车载电子行业工作经验者优先。


      Job requirements:
      1.Bachelor’s degree or above on computer science or similar major background.
      2.Solid C language knowledge and being capable to understand the digital schematic design logic.
      3.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
      4.5+ years’ developing experience in embedded system and at least 2+ years’ experience in BSP supporting and driver developing.
      5.Being familiar with bootloader, Linux kernel and being experienced with FreeRTOS is a plus.
      6.Being familiar with open source community and the tools.
      7.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

      Position Description:
      The key responsibility for the position is to debug andbring up the ATE testprogram and release to mass production, including testplan definition, ATE related HW design, ATE program debugging and productionramp up.

      The position requires the candidate working closely with SOCdesign/verification/validation and OSATs.

      主要工作职责为开发ATE测试程序并release到封测厂进行量产, 包括测试方案撰写,ATE相关硬件设计,ATE程序开发和debug 量产导入等。

      本职位要求ATE测试工程师能与SOC设计,验证人员以及外包供应商(OSAT以及其他相关测试服务供应商等)协同工作进行开发。

      Required Skills:
      3+ years working experience as ATE Engineer
      Solid knowledge of ATE Testmethodologies and ProgramDevelopment

      Capability of IP level testplan development, especially analog IP andphy IP related testplan development.

      Experience on major ATE platforms such as Advantest V93k, TeradyneUltra Flex, J750, etc.

      Capability of ATE related HW(Loadboard/socket/probecard) design &review

      Well management with outsourcing vendors

      Strong problem-solving skill and good schedule keeper
      Good team player

      3年以上ATE 工作经历

      深入理解ATE测试原理及程序开发

      具备独立撰写testplan的能力,尤其是analog IPphy IPtestplan

      具有主要ATE平台的开发经历,如爱德万V93k 泰瑞达 Ultra Flex, J750

      具有ATE相关硬件(Loadboard/socket/probecard)的设计和review经验

      具有良好的供应商管理能力,团队协作能力,问题解决能力,按期交付能力


      Education Requirement:
      - B.Sc and above degree from China top universitieswith major on EE, Micro Electronic,
      Information Engineering, Telecommunication, orAutomation etc

      毕业于电子,微电子,信息科学等相关专业

      Job Description:

      该职位是基于ARM处理器的基础上进行SoC的验证工作。主要目标是为解决汽车SoC提供解决方案和产品。入职人员需要从事与SoC设计/验证,平台设计等工作并和产品团队紧密合作,主要是负责SI高速信号测试验证,并具备可以保证产品研发阶段可测性需求分析评估和定位硬件测试故障分析的能力,工程师将在芯擎研发团队工作。


      主要职责:

      - 与EE、layout、ME合作,评估,满足产品性能的高速信号叠层、走线、互连方案。

      - 对高速信号电路设计器件选型layout走线给出理论经验方案 ,并可以对USB23/PCIE/DP/DSI/CSI/DDR等高速信号进行SI/PI仿真(可选)。

      - 芯片bench高速IO特性分析与验证。

      - 制定产品SI测试计划,保质保量完成SI测试如USB23/PCIE/DP/DSI/CSI/DDR等高低速信号测试,

      以及可以解决SI问题,改善电路设计。

      - 主要推动协调内部SI问题解决,可以推动各部门解决SI问题,保证项目进度。

      - 实验室设备控制与测试自动化的开发

      - 有SI/PI仿真能力者和硬件工程师背景更佳。

      - 具备一定的脚本编写能力。

      Job Requirements:

      - 数学、电子、通信、信号处理、自动控制、模式识别等相关专业本科及以上学历。 

      - 熟练使用SI测试设备: 示波器,VNA网络分析仪, TDR,误码仪(BERT)等。 

      - 熟练掌握USB23/PCIE/DP/DSI/CSI/DDR等高速信号的一致性测试。

      - 熟悉信号完整性及传输等理论。 

      - 具有配合硬件工程师查找高速信号设计出现的问题,并通过SI仿真提出解决方案的能力。

      - 具有负责高速信号眼图调参,优化物理层性能的能力。

      - 具备嵌入式软件开发经验者优先。

      - 中国一流大学计算机科学、电子信息工程或自动化专业本科及以上学历。


      Job Description:

      This position needs candidate to have software development knowledge on NPU driver, framework and optimization under Android and etc. The candidate should be familiar with one of MobileNet,ShuffleNet, DeepLab solution from user’s perspective. The position requires the candidate working closely with SOC design and verification, platform design and product team to work out the solution, including bare-metal, BSP driver and application framework.

      Job Requirements:

      1.      B.Sc and above degree from China top universities with major on Computer Science,EE or Automation etc.

      2.      3+ years of software development in automotive, embedded system or mobile.

      3.      Solid knowledge on ARM architectures,especially ARMv8, Cortex R and Cortex M.

      4.      Solid knowledge of machine learning,deep learning and other AI algorithms.

      5.      Strong programming skill in NPU, GPU and etc.

      6.      Familiar with deep learning frameworks, such as Caffe/Tensorflow.

      7.      Experienced in Samsung, Qualcomm, Renesas automotive platform development is a plus.

      8.      Knowledge of ISO 26262 and function safety is a plus.

      9.      Independent research ability, strong sense of responsibility.

      Job Description:

      This position needs candidate to have software development knowledge on NPU driver, framework and optimization under Android and etc. The candidate should be familiar with one of MobileNet,ShuffleNet, DeepLab solution from user’s perspective. The position requires the candidate working closely with SOC design and verification, platform design and product team to work out the solution, including bare-metal, BSP driver and application framework.

      Job Requirements:

      1.      B.Sc and above degree from China top universities with major on Computer Science,EE or Automation etc.

      2.      3+ years of software development in automotive, embedded system or mobile.

      3.      Solid knowledge on ARM architectures,especially ARMv8, Cortex R and Cortex M.

      4.      Solid knowledge of machine learning,deep learning and other AI algorithms.

      5.      Strong programming skill in NPU, GPU and etc.

      6.      Familiar with deep learning frameworks, such as Caffe/Tensorflow.

      7.      Experienced in Samsung, Qualcomm, Renesas automotive platform development is a plus.

      8.      Knowledge of ISO 26262 and function safety is a plus.

      9.      Independent research ability, strong sense of responsibility.

      Job Description:

      负责芯擎车载平台的图像渲染等graphic开发和调试

      Job Requirements:

      1. 具有2年以上手机或嵌入式系统底层软件开发调试经验.

      2. 熟练掌握C/C++/JAVA编程及系统调试方法.

      3. 具有Linux, Android下的驱动和系统开发调试经验.

      4. 具有OpenGL ES, Vulkan, OpenCL等编程和调试经验.

      5. 熟悉主流GPU架构和开发,如ARM Mali GPU, IMG GPU系列等.

      6. 熟悉ARM架构和编程,如ARMv8, Cortex ACortex M.

      7. 有高通、三星、瑞萨、MTK等芯片的车载平台开发经验优先.

      8. Screen Sharing、虚拟化开发经验者优先.

      9. 良好的学习沟通能力和问题分析解决能力,有责任心.

      Job Description:

      建立影像实验室。

      建立ISP tuning的方案,流程,标准等规范。

      车载参考开发平台上camera效果调试。

      车载平台相机效果调试软件开发,维护与优化。Camera相关算法优化。

      支持客户车载Camera效果调试。

      Job Requirements:

      2年以上相机效果调试经验,有车载相机效果调试经验者优先。

      熟悉影像实验室搭建,维护和管理。

      熟练使用平台效果调试工具,可独立完成单颗sensor模组+ISP效果调试。

       熟悉ISP图像处理流程和3A算法。

      熟悉Android/Linuxcamera软件架构,可分析和定位图像效果相关的问题,熟悉V4L2结构以及Android Camera架构者优先。

      能对ISP算法进行优化和定制者优先。

      本科及以上学历,较强的学习能力;善于沟通,良好的团队协作能力。

      Job Description:

      The position needs to be the lead or developer for embedded software such as driver, middleware,framework and application. The candidate should be familiar with Arm A, R or Marchitecture. The candidate should have solid C/C++ development skills and debugging skills of GDB or Trace32. The position requires the candidate working closely with BSP team to work out the solution from the bare-metal to driver and to application framework. 

      Job Requirements:

      1.      B.Sc and above degree from China top universities with major on Computer Science, Electronic Information Engineering, Telecommunication, EE or Automation etc

      2.      5+ years of software development in automotive, embedded system or mobile.

      3.      Solid knowledge/skills C/C++and Linux/Posix.

      4.      Solid knowledge on ARM architectures (v8- A, R or M)

      5.      Experiences in U-Boot, DTS,Linux kernel, network protocols, file system and Linux driver development.

      6.      Experiences in Linux ALSA,V4L2, DRM and etc.

      7.      Proven track record of success in Linux/Android Graphics/MM framework .

      8.      Multi-threading programming experience (pthreads).

      9.      At least one Hands-on programming experience with MM, Network, Audio.

      10.   Experiences on Android HAL integration, HW accelerator driver development and integration.

      11.   Proven debugging experiences on system and application with gdb and other system tools.

      12.   Good to follow software development flow, version control and bug tracking with GIT, Jenkins, Bugzillaor Jira.

      Job Description:

      The position needs to be the lead or developer for embedded software such as driver, middleware,framework and application. The candidate should be familiar with Arm A, R or Marchitecture. The candidate should have solid C/C++ development skills and debugging skills of GDB or Trace32. The position requires the candidate working closely with BSP team to work out the solution from the bare-metal to driver and to application framework. 

      Job Requirements:

      1.      B.Sc and above degree from China top universities with major on Computer Science, Electronic Information Engineering, Telecommunication, EE or Automation etc

      2.      5+ years of software development in automotive, embedded system or mobile.

      3.      Solid knowledge/skills C/C++and Linux/Posix.

      4.      Solid knowledge on ARM architectures (v8- A, R or M)

      5.      Experiences in U-Boot, DTS,Linux kernel, network protocols, file system and Linux driver development.

      6.      Experiences in Linux ALSA,V4L2, DRM and etc.

      7.      Proven track record of success in Linux/Android Graphics/MM framework .

      8.      Multi-threading programming experience (pthreads).

      9.      At least one Hands-on programming experience with MM, Network, Audio.

      10.   Experiences on Android HAL integration, HW accelerator driver development and integration.

      11.   Proven debugging experiences on system and application with gdb and other system tools.

      12.   Good to follow software development flow, version control and bug tracking with GIT, Jenkins, Bugzillaor Jira.

      职位描述:

      该职位负责芯擎汽车类芯片(下一代智能驾驶芯片,智能座舱芯片,高性能车规微处理器等)SOC架构设计。

      岗位职责:

      1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

      2、 负责芯片架构层面的PPA优化。

      3、 负责分析业务特点,推动软硬件协同设

      4、 负责系统性能测试和竞争性分析。

      5、 负责解决芯片设计实现过程中的技术问题,确保关键规格的达成

      任职要求:

      1、 计算机,电子工程、微电子或相关专业,硕士及以上学历

      2、 熟悉基于ARM处理器的SOC架构,熟悉总线、DDR、PCIe控制器以及各种标准外设接口,熟悉SOC前后端开发流程,熟悉性能和功耗评估;

      3、 7年以上SOC开发经验,2年以上架构设计经验

      4、 熟悉Verilog和C语言,了解VMM/OVM/UVM验证方法学

      5、 熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

      6、 具备软硬件联合开发调试经验者优先考虑

      7、 有汽车类芯片SOC整合设计或架构设计

      ?

      Job Description:

      该职位负责芯擎汽车类芯片(下一代智能驾驶芯片,智能座舱芯片,高性能车规微处理器等)SOC架构设计。

      1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

      2、 负责芯片架构层面的PPA优化。

      3、 负责分析业务特点,推动软硬件协同设

      4、 负责系统性能测试和竞争性分析。

      5、 负责解决芯片设计实现过程中的技术问题,确保关键规格的达成

      Job Requirements:


      计算机,电子工程、微电子或相关专业,硕士及以上学历

      熟悉基于ARM处理器的SOC架构,熟悉总线、DDRPCIe控制器以及各种标准外设接口,熟悉SOC前后端开发流程,熟悉性能和功耗评估;

       7年以上SOC开发经验,2年以上架构设计经验

       熟悉VerilogC语言,了解VMM/OVM/UVM验证方法学

       熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

      具备软硬件联合开发调试经验者优先考虑

      有汽车类芯片SOC整合设计或架构设计经验者优先考虑。

      良好的应用能力、沟通能力和团队精神

      ?

      Job Description:

      该职位负责芯擎汽车类芯片(下一代智能驾驶芯片,智能座舱芯片,高性能车规微处理器等)SOC架构设计。

      1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

      2、 负责芯片架构层面的PPA优化。

      3、 负责分析业务特点,推动软硬件协同设

      4、 负责系统性能测试和竞争性分析。

      5、 负责解决芯片设计实现过程中的技术问题,确保关键规格的达成

      Job Requirements:


      计算机,电子工程、微电子或相关专业,硕士及以上学历

      熟悉基于ARM处理器的SOC架构,熟悉总线、DDRPCIe控制器以及各种标准外设接口,熟悉SOC前后端开发流程,熟悉性能和功耗评估;

       7年以上SOC开发经验,2年以上架构设计经验

       熟悉VerilogC语言,了解VMM/OVM/UVM验证方法学

       熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

      具备软硬件联合开发调试经验者优先考虑

      有汽车类芯片SOC整合设计或架构设计经验者优先考虑。

      良好的应用能力、沟通能力和团队精神

      Staff Style

      Elite managers in the industry closely work together in SiEngine

      Staff Style Work Environment
      彩八彩票